Together we will keep thinking big about
measuring Small things

MicroSense is now part of KLA

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Precision Capacitive

MicroSense non-contact capacitive sensors are ideal for precise, linear position measurements and linear displacement sensing

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Solar Wafer Thickness

MicroSense in-line measurement modules offer unparalled throughput and stability for measurement of solar wafer thickness and TTV.

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Vibrating Sample

Our award winning Vibrating Sample Magnetometers are the easiest to use and most sensitive VSMs available.

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MRAM Magnetic Metrology

MicroSense offers a suite of automated magnetic measurement tools for in-plane and perpendicular STT-MRAM development and production including:

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Dimensional Wafer
Metrology Systems

Wafer measurement systems from MicroSense provide precise measuremet of wafer thickness and shape. Ideal for materials including sapphire, silicon, GaAs, InP, and SiC.

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About MicroSense

MicroSense has a singular focus on precision measurement. We provide customers with state-of-the-art measurement performance in our products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.


The MicroSense UltraMap C200A is an automated LED Sapphire Wafer Measurement system based on MicroSense’s proprietary two sided capacitive sensing technology. The system measures critical substrate parameters including Thickness, TTV, Bow, Warp and Local Thickness Variation (LTV) with high throughput. The UltraMap C200 is designed for sapphire wafer manufacturers and LED chip makers who require better wafer geometry inspection with higher measurement repeatability, compared to traditional optical metrology systems.