+1 978-843-7670

UltraMap-APBP


Automated Wafer Thickness Measurement System

Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes).

Manual Loading

  • 20mm resolution
  • Wafer 2" to 12" (50 to 300mm) round or square
  • Thickness range: 200um to 5mm
  • Automated calibration
  • 2D & 3D mapping capability
  • SECS/GEM communication

Options

  • Extended warp/bow range up to 5000um
  • Wafer prealigner
  • Samples with special shape (square, rectangle, round)

Applications

Thickness and shape measurement of wafers made of special materials: ceramics, rough material, plastics, glass, packaging material. Extremely high warp/bow wafers (10mm range).
   


Call +1-480-649-6180 today to speak with our wafer measurement experts

Or complete this form with your contact details and application requirements; we will contact you promptly.