Automated Wafer Thickness Measurement System
Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes).
- 20mm resolution
- Wafer 2" to 12" (50 to 300mm) round or square
- Thickness range: 200um to 5mm
- Automated calibration
- 2D & 3D mapping capability
- SECS/GEM communication
- Extended warp/bow range up to 5000um
- Wafer prealigner
- Samples with special shape (square, rectangle, round)
ApplicationsThickness and shape measurement of wafers made of special materials: ceramics, rough material, plastics, glass, packaging material. Extremely high warp/bow wafers (10mm range).
Call +1-480-649-6180 today to speak with our wafer measurement experts
Or complete this form with your contact details and application requirements; we will contact you promptly.