+1 978-843-7670


Automated Wafer Thickness Measurement System

Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)

  • Wafer 4” to 12” (100 to 300mm)
  • Thickness range: 50um to 3mm
  • Extended warpage range up to 5mm
  • Throughput up to 120 wafers / hour
  • 2D & 3D mapping capability
  • Full SECS/GEM compatibility
  • Automated calibration


  • Edge gripper/non-contact handling
  • Extended warp/bow range up to 5000um
  • Wafer prealigner
  • Roughness measurement


High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping



Call +1-480-649-6180 today to speak with our wafer measurement experts

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