+1 978-843-7670


Automated Wafer Thickness Measurement System

IR interferometry probe technology. Single or dual probes.

Manual Loading

  • 0.5um accuracy. 0.1um resolution
  • Wafer 4" to 12" (100 to 300mm) round or square
  • Thickness range: 20um to 1mm
  • Flexible recipe generation
  • 2D & 3D mapping capability
  • SECS/GEM communication


  • Extended warp/bow range up to 5000um
  • Wafer prealigner
  • Samples with special shape (square, rectangle, round)


Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers.


Call +1-480-649-6180 today to speak with our wafer measurement experts

Or complete this form with your contact details and application requirements; we will contact you promptly.