UltraMap-300IR

Automated Wafer Thickness Measurement System

IR interferometry probe technology. Single or dual probes.

Manual Loading

• 0.5um accuracy. 0.1um resolution
  
• Wafer 4" to 12" (100 to 300mm) round or square
  
• Thickness range: 20um to 1mm
  
• Flexible recipe generation
  
• 2D & 3D mapping capability
• SECS/GEM communication

Options

• Extended warp/bow range up to 5000um
• Wafer prealigner
• Samples with special shape (square, rectangle, round)
  

Applications

Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers.