+1 978-843-7670


Manual, Benchtop Wafer Thickness Measurement System

Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution).

  • Samples 2” to 12” (50 to 300mm)
  • Thickness range: 20um to 5mm
  • Automated calibration
  • All materials, all type of surfaces


  • Dual probes
  • Vacuum chuck for ultrathin samples


QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.

Call +1-480-649-6180 today to speak with our wafer measurement experts

Or complete this form with your contact details and application requirements; we will contact you promptly.