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UltraMap-TSV

SigmaTech TSV

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SigmaTech TSV

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The MicroSense UltraMap-TSV system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter.

The UltraMap-TSV system can be offered in class-1 compatible configuration and can also be provided with FOUP or SMIF wafer handlers.

  • Fully automated TSV and trench measurement
  • Auto-fiducial finding and pattern recognition
  • Class 1 compatible
  • Measurement from both top and bottom sides of the wafer
  • Individual features or fields of features, down to 1 micron across
  • Filled or unfilled TSVs can be measured
  • Full wafer mapping of TSV or Trench depth uniformity
  • Non Contact
  • Non Destructive

 

Call +1-480-649-6180 today to speak with our wafer measurement experts

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