Events

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SEMICON West 2013

Exhibition for Semiconductor Manufacturing Equipment

July 9-11, 2013
Moscone Center, San Francisco, California USA
Booth 2335 South Hall

SEMICON West 2013 is sure to be an exciting event for engineers seeking the latest in precision non-contact wafer measurement systems.   Applications for our SigmaTech wafer metrology systems include non-contact wafer characterization (up to 450mm), multilayer substrate, SOI, ultrathin wafers, on-tape, bumps, membranes, MEMS, solar, surface roughness, bow up to 5mm on all surfaces, bare or pattern wafers and all materials Si, GaAs, SiC, sapphire, quartz, sapphire, glass, etc. SigmaTech wafer metrology systems are scalable from bench top to fully automated Class One and integrate multiple technologies: Capacitance, Backpressure, White Light Chromatic, IR interferometry, Auto-positioning probes, and Vision. 

Other MicroSense products include:

• High resolution capacitive sensors for non-contact position and thickness measurmeent
• PV-6060 non-contact solar wafer thickness + resistivity metrology module
• New Polar Kerr MRAM metrology tool for 300mm wafers
• High sensitivity Vibrating Sample Magnetometers for magnetic characterization of any sample

New!

The World's First 300-mm Ready Non-Contact Magnetic Property Metrology System for MRAM