+1 978-843-7670

MicroSense Dimensional Wafer Metrology Systems

The highest uptime, lowest cost of ownership wafer measurement systems in the industry


Dimensional wafer metrology systems from MicroSense offer precise, non-contact, automated geometry measurements including Thickness, TTV, BOW, WARP, LTV, 2D and 3D mapping on a wide range of substrates including Sapphire, Silicon, SiC, GaAs, Glass, Quartz, Ceramics and Graphene. For measurement and control of multilayer bonded wafers, our systems can measure total wafer stacks and individual layers throughout the wafer bonding, thinning, and de-bonding process steps.

"Which wafer measurement system is best for measuring my wafers or devices?"

Call +1-480-649-6180 today to speak with our wafer measurement experts

Or complete this form with your contact details and application requirements; we will contact you promptly.


MicroSense UltraMap C200 next generation Sapphire Wafer Measurement System

 
The UltraMap C200 is a non-contact automated sapphire wafer measurement system that measures sapphire wafers, with any surface condition, with exceptional measurment repeatability and high throughput.  Sapphire remains the dominant substrate material for LED wafer manufacturing, and it is a significant part of HB-LED chip cost.  The UltraMap C200 enables wafer manufacturers and LED chip fabs to improve yields and lower cost through better dimensional control of critical wafer parameters.  The UltraMap C200 incorporates MicroSense's two sided capacitive sensor technology to measure critical geometry including sapphire wafer thickness, TTV, bow, warp and local thickness variation.  Learn More



Wafer Metrology System Selection Guide

 

Precision Capacitive Position Sensors Microsense 4800 SeriesUltraMap-300

Automated wafer thickness measurement and wafer sorting system. Measure and sort wafers based on thickness, TTV, bow, warp, LTV.  100 mm to 300 mm diameter wafers.  Learn More

 

UltraMap-TSV

The world's first 300mm fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer.   Learn More


UltraMap-300IR

Features IR interferometry probe technology, ideal for measuring thickness and shape of wafers with backgrinding tape, wafers on sawframe, dies on tape, wafers with bumps, SOI and bonded wafers.  Learn More

UltraMap-APBP

Automated measurement of non-silicon wafers, ceramics, glass and sapphire wafers in clean or non-controlled environments. Features our patented non-contact APBP back pressure measurement technology.   Learn More


UltraMap-200B

Versatile, flexible benchtop system using dual White Light chromatic coding probes for wafers up to 200 mm diameter, or solar wafers up to 156 mm squre.  Measure thickness, TTV, bow, warp and surface roughness.   Learn More

UltraMap-100B

Benchtop system with White Light chromatic coding probes for measuring up to 4" wafers, cassette to cassette loading or manual versions.  Ideal for production control of small wafers, SiC, sapphire, glass, GaN Memory Disks and InP.  Learn More

UltraMap-9600M

A manual wafer measuremnt system that uses our patented non-contact APBP back pressure  measurement teachnology.  Ideal for thin wafers and wafers on a sawframe.  Measures all materials, all surfaces.   Learn More