MicroSense Dimensional Wafer Metrology Systems
The highest uptime, lowest cost of ownership wafer measurement systems in the industry
Dimensional wafer metrology systems from MicroSense offer precise, non-contact, automated geometry measurements including Thickness, TTV, BOW, WARP, LTV, 2D and 3D mapping on a wide range of substrates including Sapphire, Silicon, SiC, GaAs, Glass, Quartz, Ceramics and Graphene. For measurement and control of multilayer bonded wafers, our systems can measure total wafer stacks and individual layers throughout the wafer bonding, thinning, and de-bonding process steps.
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MicroSense UltraMap C200 next generation Sapphire Wafer Measurement System |  | | The UltraMap C200 is a non-contact automated sapphire wafer measurement system that measures sapphire wafers, with any surface condition, with exceptional measurement repeatability and high throughput. Sapphire remains the dominant substrate material for LED wafer manufacturing, and it is a significant part of HB-LED chip cost. The UltraMap C200 enables wafer manufacturers and LED chip fabs to improve yields and lower cost through better dimensional control of critical wafer parameters. The UltraMap C200 incorporates MicroSense's two sided capacitive sensor technology to measure critical geometry including sapphire wafer thickness, TTV, bow, warp and local thickness variation. Learn More |
Wafer Metrology System Selection Guide
 UltraMap-300
Automated wafer thickness measurement and wafer sorting system. Measure and sort wafers based on thickness, TTV, bow, warp, LTV. 100 mm to 300 mm diameter wafers. Learn More |  UltraMap-TSV
The world's first 300mm fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer. Learn More |
 UltraMap-300IR
Features IR interferometry probe technology, ideal for measuring thickness and shape of wafers with backgrinding tape, wafers on sawframe, dies on tape, wafers with bumps, SOI and bonded wafers. Learn More |  UltraMap-APBP
Automated measurement of non-silicon wafers, ceramics, glass and sapphire wafers in clean or non-controlled environments. Features our patented non-contact APBP back pressure measurement technology. Learn More |
 UltraMap-200B
Versatile, flexible benchtop system using dual White Light chromatic coding probes for wafers up to 200 mm diameter, or solar wafers up to 156 mm squre. Measure thickness, TTV, bow, warp and surface roughness. Learn More |  UltraMap-100B
Benchtop system with White Light chromatic coding probes for measuring up to 4" wafers, cassette to cassette loading or manual versions. Ideal for production control of small wafers, SiC, sapphire, glass, GaN Memory Disks and InP. Learn More |
 UltraMap-9600M
A manual wafer measuremnt system that uses our patented non-contact APBP back pressure measurement teachnology. Ideal for thin wafers and wafers on a sawframe. Measures all materials, all surfaces. Learn More |
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