+1 978-843-7670


Benchtop, Automated Thickness Wafer Measurement System

  • Cassette to cassette or manual loading
  • Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
  • Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm
  • Throughput up to 100W/hours
  • 2D & 3D mapping capability
  • SECS/GEM communication. Automated calibration.


  • Wafer prealigner
  • HISCAN for Roughness and structures measurement


QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc…


Call +1-480-649-6180 today to speak with our wafer measurement experts

Or complete this form with your contact details and application requirements; we will contact you promptly.