Benchtop, Automated Thickness Wafer Measurement System
- Cassette to cassette or manual loading
- Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
- Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm
- Throughput up to 100W/hours
- 2D & 3D mapping capability
- SECS/GEM communication. Automated calibration.
- Wafer prealigner
- HISCAN for Roughness and structures measurement
QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc…
Call +1-480-649-6180 today to speak with our wafer measurement experts
Or complete this form with your contact details and application requirements; we will contact you promptly.